Semiconductor mos transistor device and method for making the same

ABSTRACT

A method of manufacturing a metal-oxide-semiconductor (MOS) transistor device is disclosed. A gate dielectric layer is formed on an active area of a substrate. A gate electrode is patterned on the gate dielectric layer. The gate electrode has vertical sidewalls and a top surface. A liner is formed on the vertical sidewalls of the gate electrode. A nitride spacer is formed on the liner. An ion implanted is performed to form a source/drain region. After salicide process, an STI region that isolates the active area is recessed, thereby forming a step height at interface between the active area and the STI region. The nitride spacer is removed. A nitride cap layer that borders the liner is deposited. The nitride cap layer has a specific stress status.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. application Ser.No. 11/927,642 filed Oct. 29, 2007 by Ting et al., which itself is adivision of U.S. application Ser. No. 11/307,660 filed Feb. 16, 2006 nowU.S. Pat. No. 7,342,284.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to the field of semiconductortransistor devices and, more particularly, to silicon nitridespacer-less semiconductor NMOS and PMOS transistor devices havingimproved saturation current and electrical performance.

2. Description of the Prior Art

High-speed metal-oxide-semiconductor (MOS) transistor devices have beenproposed in which a strained silicon (Si) layer, which has been grownepitaxially on a Si wafer with a silicon germanium (SiGe) layer disposedtherebetween, is used for the channel area. In this type of strainedSi-FET, a biaxial tensile strain occurs in the silicon layer due to thatSiGe has a larger lattice constant than Si, and as a result, the Si bandstructure alters, the degeneracy is lifted, and the carrier mobilityincreases. Consequently, using this strained Si layer for a channel areatypically enables a 1.5 to 8-fold speed increase.

FIGS. 1-3 are schematic cross-sectional diagrams illustrating a priorart method of fabricating a semiconductor NMOS transistor device 10. Asshown in FIG. 1, the conventional NMOS transistor device 10 generallyincludes a semiconductor substrate generally comprising a silicon layer16 having a source 18 and a drain 20 separated by a channel region 22.The silicon layer 16 is typically a strained silicon layer formed byepitaxially growing a silicon layer on a SiGe layer (not shown).Ordinarily, the source 18 and drain 20 further border a shallow-junctionsource extension 17 and a shallow-junction drain extension 19,respectively. A thin oxide layer 14 separates a gate 12, generallycomprising polysilicon, from the channel region 22.

In the device 10 illustrated in FIG. 1, the source 18 and drain 20 areN+ regions having been doped by arsenic, antimony or phosphorous. Thechannel region 22 is generally boron doped. A silicon nitride spacer 32is formed on sidewalls of the gate 12. A liner 30, generally comprisingsilicon dioxide, is interposed between the gate 12 and the siliconnitride spacer 32. A salicide layer 42 is selectively formed on theexposed silicon surface of the device 10. Fabrication of an NMOStransistor such as the device 10 illustrated in FIG. 1 is well known inthe art and will not be discussed in detail herein.

Referring to FIG. 2, after forming the NMOS transistor device 10, asilicon nitride cap layer 46 is typically deposited thereon. As shown inFIG. 2, the silicon nitride cap layer 46 covers the salicide layer 42and the silicon nitride spacer 32. The thickness of the silicon nitridecap layer 46 is typically in the range of between 200 angstroms and 400angstroms for subsequent etching stop purposes. A dielectric layer 48such as silicon oxide or the like is deposited over the silicon nitridecap layer 46. The dielectric layer 48 is typically much thicker than thesilicon nitride cap layer 46.

Referring to FIG. 3, subsequently, conventional lithographic and etchingprocesses are carried out to form a contact hole 52 in the dielectriclayer 48 and in the silicon nitride cap layer 46. As aforementioned, thesilicon nitride cap layer 46 acts as an etching stop layer during thedry etching process to alleviate source/drain damages caused by theetchant substances.

A need exists in this industry to provide an inexpensive method formaking a MOS or CMOS transistor device having improved functionality andperformance.

SUMMARY OF THE INVENTION

It is the primary object of the present invention to provide a method ofmanufacturing a silicon nitride spacer-less semiconductor MOS/CMOStransistor devices having improved performance.

According to the claimed invention, a method of manufacturing ametal-oxide-semiconductor (MOS) transistor device is disclosed. Themethod comprises the following steps:

providing a semiconductor substrate having thereon an active areaisolated by a shallow trench isolation (STI) region;

forming a gate dielectric layer on the active area;

forming a gate electrode on the gate dielectric layer, wherein the gateelectrode has vertical sidewalls and a top surface;

forming a liner on the vertical sidewalls of the gate electrode;

forming a silicon nitride spacer on the liner;

ion implanting the active area using the gate electrode and the siliconnitride spacer as an implantation mask, thereby forming a source/drainregion of the MOS transistor device in the active area;

forming a silicide layer on the top surface of the gate electrode and onthe source/drain region;

performing an etching process to etch away a thickness of the STIregion, thereby forming a step height h at interface between the activearea and the STI region;

removing the silicon nitride spacer; and

forming a stressed cap layer that borders the liner, wherein thestressed cap layer has a specific stress status and extends to the STIregion.

From one aspect of the present invention, a MOS transistor device isprovided. The MOS transistor device includes a semiconductor substratehaving thereon an active area; an shallow trench isolation (STI) regionisolating the active area, wherein a step height h is formed between theSTI region and the active area; a gate dielectric layer on the activearea; a gate electrode on the gate dielectric layer, wherein the gateelectrode has vertical sidewalls and a top surface; a liner on thevertical sidewalls of the gate electrode; a source region in the activearea; a drain region separated from the source region by a channelregion under the gate electrode; a silicide layer formed on the topsurface of the gate electrode, on the source region and on the drainregion; and a stressed cap layer covering the liner and the silicidelayer and extending to the STI region, wherein the stressed cap layerhas a specific stress status.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-3 are schematic cross-sectional diagrams illustrating a priorart method of fabricating a semiconductor NMOS transistor device;

FIGS. 4-11 are schematic cross-sectional diagrams illustrating a methodof fabricating semiconductor MOS transistor devices in accordance withone preferred embodiment of the present invention;

FIG. 12 demonstrates the measured current for both N/PMOS transistors(with gate length L of 32 nm and a gate width W of 1 μm) in threedifferent conditions;

FIG. 13 is a schematic cross-sectional diagram illustrating asemiconductor CMOS transistor device in accordance with anotherpreferred embodiment of the present invention; and

FIG. 14 is a schematic cross-sectional diagram illustrating asemiconductor CMOS transistor device in accordance with still anotherpreferred embodiment of the present invention.

DETAILED DESCRIPTION

Please refer to FIGS. 4-11. FIGS. 4-11 are schematic cross-sectionaldiagrams illustrating a method of fabricating semiconductor MOStransistor devices 10 and 100 in accordance with one preferredembodiment of the present invention, wherein like number numeralsdesignate similar or the same parts, regions or elements. It is to beunderstood that the drawings are not drawn to scale and are served onlyfor illustration purposes. It is to be understood that some lithographicand etching processes relating to the present invention method are knownin the art and thus not explicitly shown in the drawings.

The present invention pertains to a method of fabricating MOS transistordevices or CMOS devices of integrated circuits. A CMOS process isdemonstrated through FIGS. 4-11. As shown in FIG. 4, a semiconductorsubstrate generally comprising thereon a silicon layer 16 is prepared,wherein region 1 thereof is used to fabricate an NMOS device 10, whileregion 2 is used to fabricate a PMOS device 100. According to thisinvention, the semiconductor substrate may be a silicon substrate or asilicon-on-insulator (SOI) substrate, but not limited thereto.Preferably, the semiconductor substrate is silicon based, (e.g., silicona silicon alloy or a combination thereof including Si, SiGe, SiC, SiGeC)although any suitable semiconductor material may be used including, butnot limited to GaAs, InAs, InP or other III/V compound semiconductors.The semiconductor substrate may also include a multilayer structure inwhich at least the top layer thereof is a semiconductor. The method forforming the intermediate MOS structure depicted in FIG. 4 generallycomprises forming shallow trench isolation (STI) structure 25 in thesilicon layer 16; forming gate dielectric layers 14 and 114; forminggates 12 and 112; forming liners 30 and 130; ion implanting shallowjunction source/drain extensions; and forming spacers 32 and 132.

Using suitable implant masks, a shallow-junction source extension 17 anda shallow-junction drain extension 19 are formed in the silicon layer 16within the region 1. The source extension 17 and drain extension 19 areseparated by N channel 22. In region 2, likewise, a shallow-junctionsource extension 117 and a shallow-junction drain extension 119 areformed in the silicon layer 16 and are separated by P channel 122.

Thin gate oxide layers 14 and 114 separate gates 12 and 112 from thechannels 22 and 122, respectively. The gates 12 and 112 generallycomprise polysilicon. The gate oxide layers 14 and 114 may be made ofsilicon dioxide. However, in another case, the gate oxide layers 14 and114 may be made of any suitable high-k materials known in the art. Thegate dielectric 14 or 114 is formed on the surface of a semiconductormaterial using a suitable formation step such as for example, depositingthe dielectric, a thermal oxidation, nitridation or oxynitridation.Combinations of the aforementioned processes may also be used in formingthe gate dielectric. The gate dielectric is an insulating materialincluding an oxide, nitride, oxynitride or any combination thereof. Ahighly preferred insulating material that may be employed in the presentinvention as the gate dielectric is nitrided SiO₂ or oxynitride.Although it is preferred to use nitrided SiO₂ or oxynitride as the gatedielectric material, the present invention also contemplates usinginsulating materials, i.e., dielectrics, which have a higher dielectricconstant, k, than nitrided SiO₂. For example, the gate dielectric mayinclude a oxynitride-nitride stack, a pure nitride, a high-k oxide oroxynitride or respective silicate such as Al₂O₃, HfO₂, ZrO₂,HfO_(x)N_(y), HfSi_(x)O_(y)N_(z).

Preferably, the gate 12 or 112 is made of doped polysilicon. However,the gate is any suitable conductive material such as an alloy of dopedsilicon, such as silicon-germanium (SiGe_(x)) or silicon-carbon(SiC_(x)) and/or other conductive materials including elemental metals(W, Ta, Mo, Ti, Re, Ir, Al, etc.), metal suicides (CoSi_(x), NiSi_(x),WSi_(x), TiSi_(x)), metal nitrides (WN, TaN, TiN, TaSiN) and its alloys.The gate material can be in either crystalline, polycrystalline, oramorphous form and may include multiple layers of various conductingmaterials.

Silicon nitride spacers 32 and 132 are formed on respective sidewalls ofthe gates 12 and 112. Liners 30 and 130 such as silicon dioxide areinterposed between the silicon nitride spacer and the gate. The liners30 and 130 are typically L shaped and have a thickness of about 30˜120angstroms. The liners 30 and 130 may further comprise an offset spacerthat is known in the art and is thus omitted in the figures.

An x-z coordinate is specifically demonstrated through FIG. 4 to FIG.11, wherein x-axis represents channel direction between theshallow-junction source extension 17 and a shallow-junction drainextension 19, while z-axis represents the direction between from channelto the gate. A y-axis is the direction that is normal to the paper.

As shown in FIG. 5, after forming the silicon nitride spacers 32 and132, a mask layer 68 such as a photo resist layer is formed to mask theregion 2 only. An ion implantation process is carried out to dope N typedopant species such as arsenic, antimony or phosphorous into the siliconlayer 16, thereby forming heavily doped source region 18 and heavilydoped drain region 20. The mask layer 68 is then stripped off.

As shown in FIG. 6, a mask layer 78 such as a photo resist layer isformed to only mask the region 1. An ion implantation process is carriedout to dope P type dopant species such as boron into the silicon layer16, thereby forming source region 118 and drain region 120. The masklayer 78 is then stripped off using methods known in the art.

It is to be understood that the sequence as set forth in FIGS. 5 and 6may be converse. That is, the P type doping for the region 2 may becarried out first, then the N type doping for the region 1. After thesource/drain doping, the substrate may be subjected to an annealingand/or activation thermal process that is known in the art.

As shown in FIG. 7, a conventional salicide process is performed to forma salicide layer 42 such as nickel salicide layer atop the gates 12 and122, on the exposed source regions 18 and 118 and also on the exposeddrain regions 20 and 120. The salicide process is well known in the art.For example, the salicide process typically comprises blanket sputteringor depositing a metal layer such as cobalt or nickel over the substrate;reacting the metal layer with the silicon surfaces to form silicide; andremoving un-reacted metal layer.

Prior to the aforementioned salicide process, an etching process can beperformed to etch the exposed source/drain regions, thereby forming arecess (not shown) on the source/drain regions. A SiGe layer is thengrown on the recessed source/drain regions of the PMOS transistor, whilea SiC layer is grown on the recessed source/drain regions of the NMOStransistor.

As shown in FIG. 8, an etching process is carried out to remove apre-determined thickness of the STI structure 25 such that the topsurface of the STI structure 25 is lower than that of the adjacentsalicide layer 42. It is one feature of the present invention to form astep height h at the interface between the STI structure 25 and theadjacent salicide layer 42. According to the preferred embodiment, thestep height h is preferably between 300˜1000 angstroms, more preferably300˜500 angstroms. It is noteworthy that the step height h should be inthe aforesaid range to prevent contact junction leakage.

As shown in FIG. 9, subsequently, the silicon nitride spacers 32 and 132are stripped away, leaving the liners 30 and 130 on the sidewallsintact. According to one preferred embodiment, phosphoric acid isemployed to remove the silicon nitride spacers 32 and 132. The presentinvention features that both the NMOS transistor device 10 and the PMOStransistor device 100 do not have silicon nitride spacers (siliconnitride spacer-less) compared to the prior art MOS transistor devices.

After removing the silicon nitride spacers, approximately L shapedliners are left. However, this invention is not limited to an L shapedliner. It is to be understood that a mild etching process may be carriedout to slightly etch the liner, thereby shrinking its thickness. Inanother case, the liner may be etched away. In general, the liners 30and 130 have a thickness of about 0 to 500 angstroms.

As shown in FIG. 10, in accordance with one preferred embodiment, aconformal silicon nitride cap layer 46 is deposited on the substrate.Preferably, the silicon nitride cap layer 46 has a thickness of about30˜2000 angstroms, for example, about 1000 angstroms. The siliconnitride cap layer 46 directly borders the liners 30 and 130 resting onthe sidewalls of the gates 12 and 122 of the NMOS transistor device 10and the PMOS transistor device 100, respectively.

According to the preferred embodiment, the silicon nitride cap layer 46is initially deposited in a first stress status such as acompressive-stressed status (ex. −0.1 Gpa˜−3 Gpa). Thereafter, thesilicon nitride cap layer 46 in the region 2 is covered with a masklayer 88.

The stress of the exposed silicon nitride cap layer 46 within the region1 is altered to a second stress status that is opposite to the firststress status, i.e., a tensile-stressed status (ex. 0.1 Gpa˜3 Gpa) inthis case. By doing this, the channel region 22 is tensile-stressed bythe silicon nitride cap layer 46, while the channel region 122 iscompressively stressed by the silicon nitride cap layer 46, both in theaforesaid channel direction (x direction or x-axis).

According to the preferred embodiment, the alteration of the stressstatus of the exposed silicon nitride cap layer 46 within the region 1is accomplished by using a germanium ion implantation. However, it is tobe understood that the alteration of the stress status of the exposedsilicon nitride cap layer 46 within the region 1 may be accomplished byusing other methods known to those skilled in the art.

Furthermore, the electrical performance of both the NMOS transistordevice 10 and the PMOS transistor device 100 can be improved due to thestep height h at the interface between the STI structure 25 and thesalicide layer 42. The stress films deposited on the STI structure 25impart a secondary stress in the y-axis (i.e., the direction normal tothe paper) to the respective transistor devices. To ensure effectiveimprovement provided by the stressed nitride CESL on the performance ofthe MOS transistors, it is recommended that the step height h is no lessthan 300 angstroms.

The current gain is illustrated in FIG. 12. FIG. 12 demonstrates themeasured current for both N/PMOS transistors (with gate length L of 32nm and a gate width W of 1 μm) in three different conditions includingcondition (1): No silicon nitride cap layer and no STI etch back;condition (2): With stressed silicon nitride cap layer and no STI etchback; and condition (3): With both stressed silicon nitride cap layerand STI etch back.

As shown in FIG. 11, subsequently, a dielectric layer 48 is depositedover the regions 1 and 2 on the silicon nitride cap layer 46. Thedielectric layer 48 may be made of silicon oxide, doped silicon oxide orother suitable materials such as low-k materials.

According to another embodiment of this invention, the dielectric layer48 is stressed. For example, the dielectric layer 48 within region 1 istensile-stressed, while the dielectric layer 48 within region 2 iscompressively stressed.

Conventional lithographic and etching processes are then carried out toform contact holes 52 in the dielectric layer 48 and in the siliconnitride cap layer 46. The contact holes 52 communicate with thesource/drain regions of the devices 10 and 100. In another case, acontact hole may be formed to communicate with the gate electrode. Fromone aspect of the present invention, the silicon nitride cap layer 46acts as an etching stop layer during the dry etching of the contactholes 52 for alleviating surface damages caused by the etchantsubstances.

It is advantageous to use the present invention method because the NMOStransistor 10 is capped with a tensile-stressed silicon nitride caplayer and the PMOS transistor device is capped with acompressive-stressed silicon nitride cap layer. Since the siliconnitride spacers are removed, the stressed silicon nitride cap layer istherefore disposed more closer with the channels 22 and 122 of thedevices 10 and 100, respectively, resulting in improved performance interms of increased saturation current.

It is one salient feature of the present invention that the recessed STIstructure 25 provides a step height h at the interface between the STIstructure 25 and the salicide layer 42 of the transistor devices. Thestressed silicon nitride films deposited on the STI structure 25 imparta secondary stress in the y-axis to the respective transistors, therebyfurther improving the electrical performance.

Please refer to FIG. 13. FIG. 13 is a schematic cross-sectional diagramillustrating a semiconductor CMOS transistor device in accordance withanother preferred embodiment of the present invention. As shown in FIG.13, the stressed films 146 and 246 covering the N/PMOS transistors aredeposited respectively. The silicon nitride cap layers 146 and 246 aretensile-stressed and compressive-stressed, respectively. It is onefeature of the present invention that the silicon nitride cap layers 146and 246 overlap with each other on the STI structure 25, such that anadditive stress is created.

Please refer to FIG. 14. FIG. 14 is a schematic cross-sectional diagramillustrating a semiconductor CMOS transistor device in accordance withstill another preferred embodiment of the present invention. As shown inFIG. 14, likewise, the stressed films 146 and 246 covering the N/PMOStransistors are deposited respectively. The silicon nitride cap layers146 and 246 are tensile-stressed and compressive-stressed, respectively.It is one feature of the present invention that the silicon nitride caplayers 146 and 246 does not overlap with each other on the STI structure25.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

1. A method of manufacturing a metal-oxide-semiconductor (MOS)transistor device, comprising: providing a semiconductor substratehaving thereon an active area isolated by a shallow trench isolation(STI) region; forming a gate dielectric layer on the active area;forming a gate electrode on the gate dielectric layer, wherein the gateelectrode has vertical sidewalls and a top surface; forming a liner onthe vertical sidewalls of the gate electrode; forming a silicon nitridespacer on the liner; ion implanting the active area using the gateelectrode and the silicon nitride spacer as an implantation mask,thereby forming a source/drain region of the MOS transistor device inthe active area; forming a silicide layer on the top surface of the gateelectrode and on the source/drain region; performing an etching processto etch away a thickness of the STI region, thereby forming a stepheight h at interface between the active area and the STI region; andforming a stressed cap layer that covers the gate electrode and thesource/drain region, wherein the stressed cap layer has a specificstress status and extends to the STI region.
 2. The method ofmanufacturing a MOS transistor device according to claim 1 furthercomprising the step: before forming the stressed cap layer, removing thesilicon nitride spacer.
 3. The method of manufacturing a MOS transistordevice according to claim 1 wherein the liner comprises silicon oxide.4. The method of manufacturing a MOS transistor device according toclaim 1 wherein the stressed cap layer comprises silicon nitride.
 5. Themethod of manufacturing a MOS transistor device according to claim 1further comprising a step of forming a source/drain shallow junctionextension situated underneath the liner.
 6. The method of manufacturinga MOS transistor device according to claim 1 wherein the step height hranges between 300 and 1000 angstroms.
 7. The method of manufacturing aMOS transistor device according to claim 1 further comprising a step ofannealing the source/drain region.
 8. The method of manufacturing a MOStransistor device according to claim 1 wherein the stressed cap layerhas a thickness of about 30˜2000 angstroms.
 9. The method ofmanufacturing a MOS transistor device according to claim 1 wherein thestressed cap layer also acts as an etching stop layer during etching ofa contact hole.
 10. The method of manufacturing a MOS transistor deviceaccording to claim 1 wherein the MOS transistor device is an NMOStransistor device and wherein the stressed cap layer istensile-stressed.
 11. The method of manufacturing a MOS transistordevice according to claim 1 wherein the MOS transistor device is a PMOStransistor device and wherein the stressed cap layer iscompressive-stressed.
 12. The method of manufacturing a MOS transistordevice according to claim 1 wherein the method further comprisesrecessing the source/drain regions; and then growing a SiGe layerthereon.
 13. The method of manufacturing a MOS transistor deviceaccording to claim 1 wherein the method further comprises recessing thesource/drain regions; and then growing a SiC layer thereon.
 14. A methodof manufacturing a complementary metal-oxide-semiconductor (CMOS)transistor device, comprising: providing a semiconductor substratehaving thereon a first active area and a second active area isolated bya shallow trench isolation (STI) region; forming a first gate dielectriclayer and a second gate dielectric layer on the first active area andsecond active area, respectively; forming a first gate electrode and asecond gate electrode on the first gate dielectric layer and second gatedielectric layer, respectively, wherein both of the first gate electrodeand second gate electrode have vertical sidewalls and a top surface;forming a liner on the vertical sidewalls of the first and second gateelectrodes; forming a silicon nitride spacer on the liner; ionimplanting the first and second active areas using the first and secondgate electrodes and the silicon nitride spacer as an implantation mask,thereby forming a source/drain region; forming a silicide layer on thetop surface of the first and second gate electrodes and on thesource/drain region; performing an etching process to etch away athickness of the STI region, thereby forming a step height h atperimeter of the first and second active areas; and forming a first andsecond stressed cap layers that border the liner and extend to the STIregion, wherein the first stressed cap layer is situated over the firstactive area and is tensile-stressed, the second stressed cap layer issituated over the second active area and is compressive-stressed. 15.The method of manufacturing a CMOS transistor device according to claim14 wherein the liner comprises silicon oxide.
 16. The method ofmanufacturing a CMOS transistor device according to claim 14 wherein thefirst and second stressed cap layer comprise silicon nitride.
 17. Themethod of manufacturing a CMOS transistor device according to claim 14further comprising a step of forming a source/drain shallow junctionextension situated underneath the liner.
 18. The method of manufacturinga CMOS transistor device according to claim 14 wherein the step height hranges between 300 and 1000 angstroms.
 19. The method of manufacturing aCMOS transistor device according to claim 14 further comprising a stepof annealing the source/drain region.
 20. The method of manufacturing aCMOS transistor device according to claim 14 wherein the first stressedcap layer has a thickness of about 30˜2000 angstroms.
 21. The method ofmanufacturing a CMOS transistor device according to claim 14 wherein thesecond stressed cap layer has a thickness of about 30˜2000 angstroms.22. The method of manufacturing a CMOS transistor device according toclaim 14 wherein both of the first and second stressed cap layers act asan etching stop layer during etching of a contact hole.
 23. The methodof manufacturing a CMOS transistor device according to claim 14 whereinthe first and second stressed cap layers overlap with each other on theSTI region.
 24. The method of manufacturing a CMOS transistor deviceaccording to claim 14 wherein the first and second stressed cap layersdo not overlap with each other on the STI region.
 25. The method ofmanufacturing a CMOS transistor device according to claim 14 wherein themethod further comprises recessing the source/drain regions; and thengrowing a SiGe layer thereon.
 26. The method of manufacturing a CMOStransistor device according to claim 14 wherein the method furthercomprises recessing the source/drain regions; and then growing a SiClayer thereon.
 27. The method of manufacturing a CMOS transistor deviceaccording to claim 14 wherein before forming the first and secondstressed cap layers, the method further comprises: removing the siliconnitride spacer from the sidewalls of the first gate electrode and thesecond gate electrode.